Led by laser and movement specialists, discover the newest advances in laser drilling of VIA holes — key to enabling larger bandwidth communication and compact gadget footprints. Attendees will achieve perception into strategies for overcoming core challenges via fixed-optic configurations, superior movement management, and laser-to-motion synchronization.
Be a part of our joint webinar on the Newest Advances in Laser Drilling of VIA holes — That includes Professional Insights from Turner Laser Programs, PI, and ACS.
Matt Value (PI’s Head of Agile Options Group), Mark Turner (CEO and Founding father of Turner Laser Programs), and Jason Goerges (ACS Movement Management’s VP Advertising and marketing) will share real-world examples, together with glass wafer drilling, illustrate how these options ship outcomes. To conclude, we’ll preview rising improvements — corresponding to XL SCAN, 3D error correction, and hybrid piezo movement — that trace on the future potential for even quicker and extra correct manufacturing.
Title: Newest Advances in Laser Drilling of VIA holes
Date: July 17, 2025
Time: 2:00 PM (a)
Register now to safe your spot!
Industries Served
Semiconductor, photonics, optics, medical gadget manufacturing
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